永盛来康电子（深圳）有限公司
Winscon Electronics (Shenzhen) Co., Ltd.
PCB Product Category
6-layer Goldfinger Netcom Board--Immersion Gold+Gold Plating
6-layer TCON board - immersion gold
4 layers Semi-Well Plate
Power Board PCB
Display Panel Board
6-layer bluetooth board-immersion gold-copper edging-black Ink
Car Central Control Panel - Immersion Gold - 8 Layers
HDI long and short gold finger board--gold plated finger 30U"
Medical industry-4-layer-immersion gold
| PCB Process capability（Multilayer）制程工艺能力 | ||||
序号 No. | 工序 Process | 项目 Item | 制程能力 Process capability | |
1 | 层数 Layer | 压合 Pressing plate | 1-20 | |
2 | 板材 Material | 板材类型 Material Type | FR4 | |
| 3 | 板厚 Board thickness | 成品板厚度 Finished board thickness | 0.15-4.0mm | |
| 4 | 开料 Cutting | 最大拼板尺寸 The Max. panel size | 540×620mm | |
| 5 | 内层 Inner layer | 内层最小线宽/线距 Min. trace width/distance | 2.5/2.5mil | |
| 内层最小铜箔厚度 Min. thickness of copper foil | 1/3OZ - 2OZ | |||
| 内层对准度 Inner alignment | ±0.05mm | |||
| 线路对位偏差 Registration deviation | 0.025mm | |||
| 内层孔边距线边 Inner hole edge & margin line | 0.33mm | |||
| 内层铜皮距板边 Inner layer copper - plate edge | 0.5mm | |||
| 6 | 钻孔 Drilling | 钻咀 Drill tip | 0.15mm-6.0mm | |
| 最小孔径 The smallest aperture | 0.15mm | |||
| 孔径公差 PTH diameter tolerance PTH | ±0.05mm | |||
| 孔径公差 NPTH diameter tolerance NPTH | ±0.025mm | |||
| 纵横比 Aspect ratio | 10:1 | |||
| 7 | 外层 Outer Layer | 最小线宽/线隙 Min. trace width/gap | 0.076mm/0.076mm | |
| 基板铜厚 Base copper thickness | 1/3OZ -4OZ | |||
| 线路对准度 Registration tolerance | ±0.05mm | |||
| 阻抗控制公差 Impedance control tolerance | ±10% | |||
| 线到线路边距离 Line to line edge distance | 0.4mm | |||
| 孔环到线边最小距离 The Min distance from PTH ring to edge of line | 0.15mm/0.15mm | |||
| 线到线距离 Line to line | 0.1mm | |||
| 线到PAD距离 Line to PAD | 0.1mm | |||
| 到PAD距离 PAD to PAD PAD | 0.1mm | |||
| 线路到外形距离 The distance from panttern edge to PCB outline | 锣板 Routing | 0.2mm | ||
| 冲板 Punching | 0.3mm | |||
| 8 | 防焊 Solder resist | 最小防焊厚度（除特殊要求） Min. soldmask thickness(without special Req.) | 0.01mm | |
| 防焊开窗到线边距离 The distance from pattern edge to soldmask opening | 0.10mm | |||
| 最小防焊桥大小 Min solder resistant bridge(green oil) | 0.10mm | |||
| 最小防焊开窗大小 Min. solder resistant opening | 0.08mm | |||
| 防焊对准度 Registration tolerance | ±0.05mm | |||
| 塞孔能力 Via hole plug capability | ≤0.6mm | |||
| 9 | 丝印 Silkscreen | 最小字符宽度 Min. silkscreen width | 0.13mm | |
| 最小字符高度 Min. silkscreen height | 0.8mm | |||
| 10 | 表面处理 Surface finished | OSP厚度 OSP Thickness | 0.2-0.5um | |
| 沉锡厚度 Immersion SN Thinckness | 0.8 - 1.0um | |||
| 沉银厚度 Immersion Silver Thinckness | 0.8 - 1.0um | |||
| 无铅喷锡厚度 PB free HAL Thinckness | ≧1.0um | |||
| 沉金 Enig(without special Req.) | 金厚 Au thickness | 0.025-0.1um | ||
| 镍厚 Ni thickness | 5um | |||
| 11 | 成型 Profilling | 最小槽孔 Min. slot hole | 0.8mm | |
| 最小锣刀大小 Min. routing cut size | 0.8mm | |||
| 最大锣刀大小 Max. routing cut size | 1.6mm | |||
| 外型公差 Contour tolerance | 锣板 Routing | 0.15mm | ||
| 冲板 Punching | 0.05mm | |||
| 角度公差 V-CUT angle tolerance V-CUT | ± 5° | |||
| 余厚公差 V-CUT core thickness V-CUT | ±0.05mm | |||
| 最小V-CUT尺寸 Min V-CUT Size | 70×70mm | |||
| 冲板厚最小外型尺寸 Min connector size after punching profile | 1.0mm | |||
| 最小冲槽 Min Punching slot | 1×2mm | |||
| 冲孔刀冲槽距离 Distance from Punching hole to Punching Slot | 0.6mm (基板厚度Laminate thickness ≤ 1.2mm) | |||
| 1.6mm 1.6mm | ||||
| 12 | 成品 Finished Board | 厚度公差 Thickness tolerance | ± 5% | |
| 板翘曲公差 Wrapping tolerance | ≤0.5% | |||
